Press Releases

Qualcomm to Host Unlocking Innovation with Diversity and Connectivity forum in InnoVEX 2023

2023-05-12



As the world's leading wireless tech innovator, Qualcomm is leading the world towards a diverse smart mobile future, connecting millions of devices by using the advanced 5G technology. Qualcomm's one technology roadmap with leadership in wireless connectivity scales its leading portfolio of essential innovations to expand the Company's breakthrough solutions to support virtually every connected device across industries and sectors, including automotive and the IoT.

By leveraging this vision, Qualcomm believes that true innovation demands a multifaceted perspective and aims to build a pipeline of diverse talent to cultivate innovators who bring varying backgrounds, ideas, and points of views, further propelling innovations that will power the future.

To share Qualcomm's core value of diversity and inclusion as well as to highlight the connectivity bringing the real impact for businesses in all industry, Qualcomm will host a forum in InnoVEX 2023 with the theme on Unlocking Innovation with Diversity and Connectivity. The Qualcomm Forum will be held on May 31, 10:00 – 12:00 and will focus on how startups can unlock innovation with diversity and connectivity. Startups from Qualcomm Innovate in Taiwan Challenge and friends from the ecosystem will join the forum and discuss the rise of emerging technologies and female leadership in the field of innovation and entrepreneurship; as well as how the innovation drives the expansion of IoT ecosystems.

The forum will include 2 panel discussions with the following speakers:

  • Panel 1 – Women in the Startup Ecosystem – Driving Innovative Ideas
    • Andrea T. J. Hsu, Director General, Department of Academia Industry Collaboration and Science Park Affairs, National Science and Technology Council
    • Yvie Tai, Director, Business Development & Program Manager of Qualcomm Innovate in Taiwan Challenge (QITC), Qualcomm
    • Lynia Huang, CEO of Bamboo Technology Ltd.
    • Monica Lee, COO & CoFounder of Aiseed Inc.
  • Panel 2 – Fueling Innovation and Expanding the Ecosystems in IoT
    • Han Lu, Regional Sales Manager of Qualcomm
    • James Wu, CEO of NexRetail
    • John Chang, CEO of Moldintel Co., Ltd.
    • Mark Chang, COO& CTO of APrevent Medical
  • The forum is open for registration and visitors can find more details in the official Unlocking Innovation with Diversity and Connectivity forum page. In addition to hosting the forum, this year Qualcomm also supports the InnoVEX Pitch Contest by offering the Qualcomm Innovation Award, looking forward to encouraging startups with innovative technologies in 5G, AI & IoT to demonstrate their creative ideas and competitiveness.

    About InnoVEX

    Started in 2016, InnoVEX is a startup focused exhibition organized by Taipei Computer Association (TCA) and Taiwan External Trade Development Council (TAITRA). Positioned as the innovation hub of Asia, InnoVEX is held alongside Asia’s leading ICT B2B Tradeshow, COMPUTEX; to connect startups and their innovations to global VCs, CVCs, manufacturing partners, buyers, and media.

    InnoVEX 2023 will be held onsite from May 30 to June 2, 2023 in Taipei Nangang Exhibition Center Hall 2. The visitor registration is open now. Get your visitor badge here today! Interested parties can also follow InnoVEX in various social media channels.

    Follow the InnoVEX Social Media channels for more news and updates:

    Facebook: https://www.facebook.com/computexinnovex
    Twitter: https://twitter.com/InnoVEX3
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    YouTube: https://www.youtube.com/c/InnoVEX_taipei/
    Instagram: https://www.instagram.com/innovex_taipei/

    Media Contact

    Taipei Computer Association    Tel: +886-2-25774249  Fax: +886-2-25785392

    David Liu 360  Email: david_liu@mail.tca.org.tw

    Sharlene Hung 324  Email: sharlene@mail.tca.org.tw

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